Is It On KEV?

Qualcomm Multiple Chipsets

YES - ON THE CISA KEV LIST
CVE-2023-33063

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

CISA catalog due date2023-12-26
overdue since 2023-12-26
EPSS exploit probability (next 30 days)0.7% · 53percentile
From CVE publication to KEV listing0 days (2023-12-05 → 2023-12-05)
Remediation window (KEV listing to due date)21 days
Days on the KEV list1072 days
Date added to KEV2023-12-05
Known ransomware campaign useUnknown
VendorQualcomm
ProductMultiple Chipsets
Weaknesses (CWE)CWE-416

Qualcomm: 12 entries (0.7% of all KEV entries are from this vendor); 1 added in 2026.

BOD 26-04 note: this is the date printed in the CISA catalog. A federal agency's actual deadline is set by its SSVC tier - Act (3 days), Attend (14 days), Track (60 days), or the next scheduled upgrade - counted from the KEV listing date or the date the vulnerability is identified in its environment, whichever comes first. Use the tier helper on each CVE page for your own window.

Your BOD 26-04 window (SSVC tier helper)

Your remediation window ends:

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Required action (CISA)

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Notes

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063

References

Other KEV entries for this vendor: Qualcomm

Qualcomm - Vendors with KEV entries

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