Qualcomm Multiple Chipsets
YES - ON THE CISA KEV LIST
CVE-2024-43047
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
overdue since 2024-10-29
Qualcomm: 12 entries (0.7% of all KEV entries are from this vendor); 1 added in 2026.
BOD 26-04 note: this is the date printed in the CISA catalog. A federal agency's actual deadline is set by its SSVC tier - Act (3 days), Attend (14 days), Track (60 days), or the next scheduled upgrade - counted from the KEV listing date or the date the vulnerability is identified in its environment, whichever comes first. Use the tier helper on each CVE page for your own window.
Your BOD 26-04 window (SSVC tier helper)
Your remediation window ends:
Description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
Required action (CISA)
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Notes
https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047
References
Other KEV entries for this vendor: Qualcomm
- CVE-2026-21385 - Multiple Chipsets (2026-03-03)
- CVE-2025-21479 - Multiple Chipsets (2025-06-03)
- CVE-2025-21480 - Multiple Chipsets (2025-06-03)
- CVE-2025-27038 - Multiple Chipsets (2025-06-03)
- CVE-2023-33107 - Multiple Chipsets (2023-12-05)
- CVE-2023-33106 - Multiple Chipsets (2023-12-05)
- CVE-2023-33063 - Multiple Chipsets (2023-12-05)
- CVE-2022-22071 - Multiple Chipsets (2023-12-05)
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